Printed Circuit Board Designer’s Guide to… Thermal Management with Insulated Metal Substrates, Vol. 2

Excerpt: The Printed Circuit Board Designer’s Guide to… Thermal Management with Insulated Metal Substrates, vol. 2

Introduction
The PCB Designer’s Guide to… Thermal Management with Insulated Metal Substrates, Volume 2, by Didier Mauve and Robert Art is the second in a two-part series. This book builds on the material presented in the first by describing the latest products and design techniques for thermal management with IMS.

The first volume comprehensively covers heat transfer principles and thermal system modeling to help engineers quantify thermal management challenges in the current application, the nature of IMS, typical material parameters and the choices available to designers to achieve the desired performance.

We recommend that you read the first book so you understand the problem from first principles, how to navigate the many material choices on offer, and appreciate how adjusting to different combinations of material types and thicknesses can help you find a solution that meets your requirements from all points of view, especially system reliability, size, cost and manufacturability.

The PCB Designer’s Guide to… Thermal Management with Insulated Metal Substrates, Volume 2, covers additional use cases and materials, including those used for high temperature applications as well as high emissivity surface treatment which can significantly improve thermal performance. A web-based thermal calculator is featured which allows for the exact size of baseplate needed to achieve the desired thermal performance in the smallest possible volume, much smaller than would be possible with a heatsink of appropriate size.

Volume 2 delves into issues such as test methods and how they can affect IMS material ratings and analyzes the effects of tolerances in material properties and thickness on overall thermal conductivity. Understanding this can have a critical influence on measurement error, ultimately determining whether or not an accurate result for reliability can be calculated. The authors examine how issues such as solder cracks affect thermal performance and share application examples showing design with multi-layer IMS.

As application challenges have evolved and new types of thermal components and materials have come to market, there is more to be said about thermal management and the options available to designers looking for an effective solution. economical and compact to achieve system reliability objectives.

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